The heat dissipation problem has become a key indicator affecting the performance of LED street lamps.

LED street lamp heat dissipation problem analysis LED light source's light conversion rate is only 20%, 80% of input power is converted into heat energy, if the heat energy can not be dissipated, it will greatly affect the LED's service life, and will also reduce the LED's luminous efficiency, resulting in Severe light decay. The problem is that most of the heat generated by the LEDs can only be dissipated in a conductive manner, so these heats require a long path to be dissipated into the surrounding environment. How to keep the temperature of the LED light source at a relatively reasonable level and ensure the stable operation of the light source is an urgent problem to be solved by the LED street lamp. At the same time, in order to meet the lighting power needs, the LEDs on the street lamps are arranged into multiple light sources. When the LEDs are densely arranged to form a white light illumination system, the heat dissipation problem is more serious, and the heat dissipation problem becomes a key indicator affecting the performance of the LED street lamps.

Thermal resistance analysis of LED street lamps The thermal resistance of street lamps during heat dissipation is mainly composed of four parts: thermal resistance of LED package chip, thermal resistance of bonding material, diffusion thermal resistance between heat source and heat sink, and convection between heat sink and environment. Heat transfer resistance. An LED street light contains multiple LEDs, so the diffusion thermal resistance is in multiple parallel relationships. Among the above four thermal resistances, the thermal resistance of the chip is generally determined by the process of packaging the chip. The thermal resistance of the bonded portion is related to the coating process and the bonding material during fabrication. The diffusion thermal resistance is closely related to the arrangement and size of the chip. The physical quantity, convective heat transfer thermal resistance involves a relatively complex convective heat transfer process, the size of which depends on the heat dissipation design of the luminaire. LED street lamp cooling solution to solve the problem of LED street lamp heat dissipation, must start from the above four parts of thermal resistance, use flip chip technology to reduce the thermal resistance of LED package chip; use high thermal conductivity bonding material to solve the thermal resistance of bonding materials; Appropriate materials reduce the diffusion heat resistance between the heat source and the heat sink, and rationally design the lamp structure to solve the convective heat transfer resistance between the heat sink and the environment. Simply put, the solution includes solving the heat dissipation design of the LED light source and the heat dissipation design of the lamp. Only by doing the work of these two parts can the heat dissipation problem of the LED street lamp be better solved.

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